Patent Number: 5,492,613
Date of Patent: Feb. 20,1996
PROCESS FOR ELECTROLESS PLATING A METAL ON NON CONDUCTIVE
The present invention discloses a process for electroless plating a metal on the surface of almost all the common nonconductive material substrates by brushing or spraying composite chemical solutions onto said surface. When practicing the present invention, metal can be quickly deposited on the surface and firmly bound with the substrate. In addition, the composite chemical solutions used in the invention can be prepared from raw chemicals which are nontoxic and do not cause environmental pollution. Since the process does not require immersing or dipping, it allows metal to be deposited either on the entire surface or on a portion of a surface of the substrate without any restriction of the dimensions of the substrate. In one embodiment, the substrates may be glass, silicates or ceramics and may he sensitized using a solution which, comprises about 25 175 g/l SnCl, about 35-110 g/l of abut 36% HCI, and about 50-100 g/l of about 95% ethanol. The sensitizing solution may also contain an indicator such as thymol blue.